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MediaTek Announces Dimensity 9000 Chipset for Flagship-Tier Mobile Devices

Watch out, Qualcomm!

MediaTek has recently announced the company's latest 5G chipset, the Dimensity 9000, specially designed for flagship-tier Android mobile devices. It is the first chip to be built on TSMC's 4nm process, alongside ARM's new v9 architecture. It is also the first to use a Cortex-X2 core clocked up to 3.05 GHz and is the world's first smartphone chip to support Bluetooth 5.3 as well as Wi-Fi 6E standard.

The Dimensity 9000 features the company's latest fifth-generation 6-core APU, which is claimed to deliver 4 times better performance and power efficiency compared to its predecessors. Its Image Signal Processor (ISP), MediaTek's new 18-bit Imagiq Gen 7 can capture 4K HDR video from three cameras simultaneously. For images, it can capture up to 320 MP and transfer data at 9 gigapixels per second.

As for connectivity, it includes an onboard 5G modem, which supports sub-6 GHz 5G with 3GPP Release-16 features and has maximum download speeds of 7 Gbps with 3CC carrier aggregation. For improved battery life, MediaTek uses its own PowerSave technology.

It won't be long until we see them in upcoming smartphones as the company says those devices will be arriving in late Q1 next year globally. While the new chipset sounds powerful, it's still unknown if it will rival the Snapdragon chipsets in terms of performance.


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