Samsung announced that it has begun mass production of its new LPDDR5 UFS-based multichip package, which offers "lightning-fast speed and high storage capacity at very low power".
Samsung says that the new uMCP, which pairs LPDDR5 DRAM with UFS 3.1 NAND flash, offers 2x better NAND flash performance than what you’d get with LPDDR4X-based UFS 2.2 storage, with a speed of 3GB/s. For DRAM performance, Samsung lists a speed of 25GB/s.
The new chip has a size of 11.5mm x 13mm, and it can pack 6GB to 12GB of DRAM along with 128GB to 512GB of storage.
Young-soo Sohn, the vice president of Samsung Electronic’s Memory Product Planning Team, said that the uMCP will allow “consumers to enjoy uninterrupted streaming, gaming and mixed reality experiences even in lower-tier devices”.
Devices with the new uMCP are expected to enter mainstream markets from this month, with compatibility tests already completed with several manufacturers.